0 Totale0
Home | Book_usa | Physics - Electromagnetism | Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

di Er-Ping Li

Aggiungi al carrello
  • Prezzo: € 97.13
Spedizione a 1€ sopra i 19 euro! (Scopri come)
Normalmente disponibile in 4/5 giorni lavorativi

Dettagli del libro

Commenti degli utenti

Scrivi un nuovo commento su Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC e condividi la tua opinione con altri utenti.